Model Number: Electronic Assembly-1-1-1-1-1
Brand Name: BAM
Key Specifications/Special Features:
Material: rigid and flexible PCBBoard thickness: 0.6 to 3mmSurface: gold plating and immersion goldLayers: 2 to 16Blind and buried
High TG and frequency
Lead-free
Twist and warp: <1% 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210
Dip pitches through hole down to 0.60mm
Solder components to underside of board without disrupting topside Inspection inline for QOI and ICT testing inline
X-ray inspection for BGA
Maximum panel size: 550x660mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
OEM/ODM services are welcome
High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer
RoHS Directive-compliant